AMAT CTI-Cryogenics 8116071G001 On-Board 8F Cryopump

The AMAT 8116071G001 On-Board 8F is a high-performance cryopump manufactured by AMAT, specially configured for Applied Materials Endura HP PVD semiconductor processing platforms. It creates and maintains ultra-high vacuum environments required for thin film deposition processes inside process chambers.

This enhanced 3-phase onboard cryopump delivers fast pump-down speed and stable gas capture capacity. It integrates onboard control electronics and interfaces seamlessly with AMAT host control systems. Widely used for semiconductor fab equipment maintenance, spare parts replacement and tool upgrade projects.

Main Specifications

• Brand: CTI-Cryogenics (AMAT OEM Version)
• Model: 8116071G001 On-Board 8F Cryopump
• Compatible Equipment: AMAT Endura HP PVD System
• Power Configuration: 3-phase enhanced onboard drive
• Flange Standard: 10-inch CF vacuum flange
• Operation Type: Closed-cycle cryogenic vacuum pump
• Working Temperature: Cryogenic two-stage cold head design
• Control: Integrated on-board controller with communication interface
• Operating Ambient: 10°C ~ 35°C cleanroom environment
• Installation: Direct onboard mounting for Endura process module

Core Functions

• Generate ultra-high vacuum environment for physical vapor deposition process
• Capture and condense residual gas molecules via two-stage cold head assembly
• Provide fast pump-down performance to shorten chamber cycle time
• Support stable continuous operation for 200/300mm wafer processing
• Onboard electronics realize local pump control and status monitoring
• Transmit operational status, temperature and fault data to AMAT host controller
• Support automatic regeneration procedure for cryogenic cold surfaces
• Built-in protection against over-temperature and abnormal operating conditions
• Maintain consistent vacuum stability to guarantee film uniformity quality
• Designed for seamless mechanical and electrical matching with Endura platform

Application Scenarios

• Semiconductor fab AMAT Endura HP PVD thin-film processing equipment
• 200mm and 300mm wafer metallization and barrier layer deposition processes
• Integrated circuit manufacturing front-end vacuum processing platforms
• Display panel and compound semiconductor deposition production lines
• Semiconductor equipment maintenance and spare parts replacement projects
• Research laboratory ultra-high vacuum thin film deposition systems
• Memory chip manufacturing physical vapor deposition process chambers
• Equipment upgrade and performance optimization for existing Endura tools
• Cleanroom vacuum system supporting advanced semiconductor manufacturing
• High-precision surface coating and material science vacuum processing platforms